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high-performance products ?ate 1 www.semtech.com edge211 dual pin electronics driver description features functional block diagram applications revision 5 / october 23, 2001 the edge211 is a dual trinary driver manufactured in a wide voltage cmos process. it is designed for automatic test equipment and instrumentation where cost, functional density, and power are all at a premium. each tristatable driver is capable of generating 3 levels - one for a logic high, one for a logic low, and one for either a termination voltage or a special programming voltage. the edge211 is intended to offer an extremely low leakage, low cost, low power, small footprint, driver solution for 100 mhz and below pin electronics applications. 100 mhz operation 12v i/o range programmable output levels flex in digital inputs (technology independent) ? three level driver ? extremely low leakage currents (~0 na) ? small footprint (32 pin, 7 mm x 7 mm, tqfp package) low cost automatic test equipment vh0 vtt0 vl0 vh1 vtt1 vl1 dout0 dout1 data0 data0* data1 data1* dvr en0 dvr en0* dvr en1 dvr en1* vtt en0 vtt en0* vtt en1 vtt en1*
2 ? 2000 semtech corp. www.semtech.com high-performance products ?ate edge211 pin description e m a n n i pe m a n n i p e m a n n i p e m a n n i pe m a n n i p* n i p* n i p * n i p * n i p* n i pn o i t p i r c s e dn o i t p i r c s e d n o i t p i r c s e d n o i t p i r c s e dn o i t p i r c s e d * 0 a t a d / 0 a t a d * 1 a t a d / 1 a t a d 9 2 , 0 3 2 1 , 1 1 r e v i r d e h t f o s u t a t s w o l / h g i h e h t s e n i m r e t e d t a h t t u p n i l a t i g i d . d e l b a n e s i t i n e h w * 0 n e r v d / 0 n e r v d * 1 n e r v d / 1 n e r v d 1 3 , 2 3 0 1 , 9 e h t s e c a l p r o , r e v i r d e h t s e l b a s i d d n a s e l b a n e t a h t t u p n i l a t i g i d . e t a t s t t v e h t n i r e v i r d * 0 n e t t v / 0 n e t t v * 1 n e t t v / 1 n e t t v 1 , 2 8 , 7 r e v i r d e h t s e c a l p * n e r v d r e h t e h w s e n i m r e t e d t a h t t u p n i l a t i g i d . l e v e l t t v e h t o t s e v i r d y l e v i t c a r o e t a t s e c n a d e p m i h g i h a n i 0 t u o d 1 t u o d 3 2 8 1 . t u p t u o r e v i r d 1 h v , 0 h v 1 l v , 0 l v 1 t t v , 0 t t v 7 1 , 4 2 6 1 , 5 2 5 1 , 6 2 , 1 l a c i g o l a f o l e v e l e g a t l o v e h t t e s t a h t s t u p n i g o l a n a d e r e f f u b n u . t u p t u o r e v i r d e h t t a t t v r o , 0 s e i l p p u s r e w o ps e i l p p u s r e w o p s e i l p p u s r e w o p s e i l p p u s r e w o ps e i l p p u s r e w o p 0 c c v 1 c c v 7 2 , 2 2 , 3 9 1 , 4 1 , 6 . y l p p u s r e w o p g o l a n a e v i t i s o p 0 e e v 1 e e v 8 2 , 1 2 , 4 0 2 , 3 1 , 5 . y l p p u s r e w o p g o l a n a e v i t a g e n
3 ? 2000 semtech corp. www.semtech.com high-performance products ?ate edge211 pin description (continued) 32 pin, 7 mm x 7 mm, tqfp package 1 25 17 9 dvr en0 dvr en0* data0 data0* vee0 vcc0 vtt0 vl0 vh0 dout0 vcc0 vee0 vee1 vcc1 dout1 vh1 vtt en0* vtt en0 vcc0 vee0 vee1 vcc1 vtt en1 vtt en1* dvr en1 dvr en1* data1 data1* vee1 vcc1 vtt1 vl1
4 ? 2000 semtech corp. www.semtech.com high-performance products ?ate edge211 circuit description driver description the edge211 supports three distinct programmable driver levels high, low, and termination, along with high impedance. there are no restrictions between any of these three levels in that all three may vary independently over the entire operating voltage range between vcc and vee. digital inputs all digital inputs are wide voltage comparator inputs, and are therefore technology independent. the edge211 may be driven by ttl, ecl, cmos, or any custom level circuitry. figure 1. driver digital inputs do not leave any driver digital inputs floating. the dvr en*, data, and vtt en are digital input pins that can be used to control the driver output level displayed at the dout pin. dvr en, data*, and vtt en* can be connected to a reference voltage which defines the logic triggering level. the relationship between the driver control pins and their corresponding logic levels can be seen in table 1. table 1. using the logic levels defined in table 1, driver functionality is described in table 2. table 2. note that dvr en* determines whether the driver output state will be controlled by the vtt en or the data pin. with dvr en high (logic 1), the driver output pin, dout, is controlled by the vtt en pin and can be toggled between the voltage value applied at vtt, and a high impedance state. with dvr en* low (logic 0), dout can be toggled between the voltage values applied to the vl and vh pins by using the data input pin. vh, vl, and vtt vh, vl, and vtt define the logical 1 , 0 , and termination levels of the driver and can be adjusted anywhere over the range spanned by vcc to vee. there is no restriction between vh, vl, and vtt, in that they can all vary independently over the entire voltage range determined by the power supply levels. the vh, vl, and vtt inputs are unbuffered in that they also provide the driver output current, so the sources of these voltages must have ample current drive capability. while vtt is referred to as the termination voltage, it may also be used as a very high programming level on many memory devices. * n e r v d* n e r v d * n e r v d * n e r v d* n e r v dn e t t vn e t t v n e t t v n e t t vn e t t va t a da t a d a t a d a t a da t a dt u o dt u o d t u o d t u o dt u o d 10x z i h 11x t t v 0x0 l v 0x1 h v data data* dvr en* dvr en vtt en vtt en* e g a t l o v t u p n i c i g o l g n i d n o p s e r r o c l e v e l v a t a d v > * a t a d 1 = a t a d v a t a d v < * a t a d 0 = a t a d v n e r v d v > * n e r v d 0 = * n e r v d v n e r v d v < * n e r v d 1 = * n e r v d v n e t t v v > * n e t t v 1 = n e t t v v n e t t v v < * n e t t v 0 = n e t t v
5 ? 2000 semtech corp. www.semtech.com high-performance products ?ate edge211 circuit description (continued) driver output protection the edge211 is designed to operate in a functional testing environment where a controlled impedance (typically 50 ohms) is maintained between the pin electronics and the dut. in general, there will be an external resistor at the driver output which series terminates the transmission line to the dut. in this environment, the driver can withstand a short to any legal dut voltage for an indefinite amount of time. in a low impedance application with no additional output series resistance, care must be exercised and systems should be designed to check for this condition and tristate the driver if a short is detected. the driver does not have on-chip short circuit protection or limitation circuitry.
6 ? 2000 semtech corp. www.semtech.com high-performance products ?ate edge211 application information power supplies decoupling a .1 f capacitor is recommended between vcc and vee. in addition, solid vcc and vee planes are recommended to provide a low inductance path for the power supply currents. these planes will reduce any inductive supply drops associated with swtiching currents on the power supply pins. if solid planes are not possible, then wide power busses are preferable. vh, vl, and vtt decoupling as the vh, vl, and vtt inputs are unbuffered and must supply the driver output current, decoupling capacitors for these inputs are recommended in proportion to the amount of output current the application requires. in general, a surge current of 50 ma (5v swings series terminated with 50 ? into a 50 ? transmission line) are the maximum dynamic output currents the driver should see. the decoupling capacitors should be able to provide this current for the duration of the round trip time between the pin electronics and the dut, and then recharge themselves before the next such transition would occur. once this condition is satisfied, the vh, vl, and vtt supply voltages are more responsible for establishing the dc levels associated with each function and recharging the capacitors, rather than providing the actual dynamic currents required to drive the dut transmission line. ideally, vh, vl, and vtt would each have a dedicated power layer on the pc board for the lowest possible inductance power supply distribution. power supply sequencing the following sequence should be used when powering up the edge211. 1. vcc 2. vee 3. analog inputs (vh, vl , vtt) 4. digital inputs (vtten, dvren, data) latchup protection the edge211 has several power supply requirements to protect the part in power supply fault situations, as well as during power up and power down sequences. vcc must remain greater than or equal to vdd (external supply for the digital logic) at all times. both vcc and vdd must always be positive (above ground), and vee must always be negative (at or below ground). the three diode configuration shown in figure 2 should be used on a once-per-board basis. figure 2. power supply protection scheme gure 5. warning: it is extremely important that the voltage on any device pin does not exceed the range of vee ?.5v to vcc +0.5v at any time, either during power up, normal operation, or during power down. failure to adhere to this requirement could result in latchup of the device, which could be destructive if the system power supplies are capable of supplying large amounts of current. even if the device is not immediately destroyed, the cumulative damage caused by the stress of repeated latchup may affect device reliability. vcc vdd vee 1n5820 or equivalent external system ground
7 ? 2000 semtech corp. www.semtech.com high-performance products ?ate edge211 package information pin descriptions b d 3 4 4 e n / 4 tips 4 x e / 2 d / 2 see detail "a" e 0.20 c a C b d top view d1 e1 5 7 5 7 4 x d1 / 2 e1 / 2 0.20 h a C b d bottom view c o o
8 ? 2000 semtech corp. www.semtech.com high-performance products ?ate edge211 package information (continued) 3 detail "a" e / 2 b 0 min. 0.08 / 0.20 r. gauge plane 0.25 0 C 7 l c.08 r. min. 0.20 min. 1.00 ref. datum plane C h C a2 0.05 a1 C s detail "b" 9 ''' "

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--- ) ) jedec variation all dimensions in millimeters ac min. nom. max. note a 1.60 a1 0.05 0.10 0.15 a2 1.35 1.40 1.45 d 9.00 bsc. 4 d1 7.00 bsc. 7,8 e 9.00 bsc. 4 e1 7.00 bsc. 7,8 l 0.45 0.60 0.75 m 0.15 n32 e 0.80 bsc. b 0.30 0.37 0.45 9 b1 0.30 0.35 0.40 ccc 0.10 ddd 0.20 notes: 1. all dimensions and tolerances conform to ansi y14.5-1982. 2. datum plane -h- located at mold parting line and coincident with lead, where lead exits plastic body at bottom of parting line. 3. datums a-b and -d- to be determined at centerline between leads where leads exit plastic body at datum plane -h-. 4. to be determined at seating plane -c-. 5. dimensions d1 and e1 do not include mold protrusion. 6. n is the total # of terminals. 7. these dimensions to be determined at the datum plane -h-. 8. package top dimensions are smaller than bottom dimensions and top of package will not overhang bottom of package. 9. dimension b does not include dambar protrusion. allowable dambar protrusion shall be 0.08 mm total in excess of the b dimension at maximum material condition. dambar cannot be located on the lower radius or the foot. 10. controlling dimension: millimeter. 11. maximum allowable die thickness to be assembled in this package family is 0.30 millimeters. 12. this outline conforms to jedec publication 95, registration mo-136, variations ac, ae, and af.
9 ? 2000 semtech corp. www.semtech.com high-performance products ?ate edge211 recommended operating conditions absolute maximum ratings parameter symbol min typ max units positive analog power supply vcc 6 12 v negative analog power supply vee -5 -3 v total analog power supply vcc - vee 9 12 v junction tj +125 o c parameter symbol min typ max units total analog power supply vcc - vee 0 13 v positive analog power supply vcc 0 13 v negative analog power supply vee -6 0 v analog input voltages vee - .5 vcc + .5 v digital inputs vee - .5 vcc + .5 v ambient operating temperature ta -55 +125 o c storage temperature -65 +150 o c junction temperature tj +150 o c soldering temperature 260 o c stresses above listed under absolute maximum ratings may cause permanent damage to the device. this is a stress rating only and functional operation of the device at these or any other conditions above those listed in the operational sections of this specification is not implied. exposure to absolute maximum rating conditions for extended periods may affect device reliability.
10 ? 2000 semtech corp. www.semtech.com high-performance products ?ate edge211 dc characteristics parameter symbol min typ max units programmable driver output voltages driver output swing vh, vl, vtt vh ?vl vh ?vtt vtt ?vll vee vee ?vcc vee ?vcc vee ?vcc vcc vcc ?vee vcc ?vee vcc ?vee v v v v dc driver output current ac driver output current iout dc iout ac ?0 ?20 +50 +220 ma ma output impedance vh (@ +3.0v) (note 3) vtt (@ +1.5v) (note 3) vl (@ 0.0v) (note 3) rout ?hi rout ?vtt rout ?low 21.6 22.3 22.3 23.6 24.3 24.3 25.6 26.3 26.3 ? ? ? dut pin capacitance (driver off) cout 13 pf high impedance leakage current (note 1) ileak 0 4 na vh / vl / vtt offset voltage (note 2) vos ?00 +100 mv vh / vl / vtt gain and linearity error (note 2) ?.5% + 5) +(.5% + 5) mv power supply positive supply current negative supply current icc iee 23 23 32 32 ma ma total rms supply current @ 80 mhz ac + dc positive supply current ac + dc negative supply current (note 1) 70 70 ma ma driver characteristics digital inputs data, dvr en*, vtt en parameter symbol min typ max units input high voltage input - input* 800 mv input low voltage input* - input 800 mv input current iin 0 1.0 a digital input voltage range input, input* -2.0* +5.0 v note 1: this parameter is guaranteed by design and characterization. production testing is performed against a 250 na limit. note 2: no load conditions. note 3: tester min / max limits set to typ 2.0 ? . tester repeatability = .8 ? . * -2v or (vee + 2.0v), whichever is more positive.
11 ? 2000 semtech corp. www.semtech.com high-performance products ?ate edge211 ac characteristics parameter symbol min typ max units propagation delay data in to dout dvr en* to dout (active to hiz) (note 2) dvr en* to dout (hiz to active) (note 4) 7 7 7 11 11 11 14 14 15 ns ns ns minimum pulse width (3v swing) 4 5 ns toggle rate fmax 100 mhz dout output rise/fall times (note 1) 1v swing (20% - 80%) 3v swing (10% - 90%) 5v swing (10% - 905) 1.0 1.3 1.4 1.6 3.0 4.0 ns ns ns driver temperature coefficient ? tpd/ ? t <25 ps / o c driver edge to edge matching <500 ps tpd vs. pulse width (note 3) <100 ps i/o voltage spike -500 500 mv overshoot / undershoot - (3% + 50) + (3% + 50) %swing + mv note 1: into 18 cm of 50 ? transmission line terminated with 1k ? and 5 pf with the proper series termination resistor. note 2: measured at a voltage change of 500 mv with a 30 ma load. (vh = +5v, vl = 0v) note 3: tested with an input pulse of 20 ns, 30 ns, and 80 ns. t = 100 ns. note 4: 4 ma load current.
12 ? 2000 semtech corp. www.semtech.com high-performance products ?ate edge211 ordering information contact information semtech corporation high-performance division 10021 willow creek rd., san diego, ca 92131 phone: (858)695-1808 fax (858)695-2633 r e b m u n l e d o mr e b m u n l e d o m r e b m u n l e d o m r e b m u n l e d o mr e b m u n l e d o me g a k c a pe g a k c a p e g a k c a p e g a k c a pe g a k c a p f t a 1 1 2 ep f q t n i p - 2 3 f t a 1 1 2 m v ee l u d o m n o i t a u l a v e 1 1 2 e g d e
13 ? 2000 semtech corp. www.semtech.com high-performance products ?ate edge211 revision history current revision date: october 23, 2001 previous revision date: june 27, 2001 # e g a pe m a n n o i t c e sn o i s i v e r s u o i v e r p n o i s i v e r t n e r r u c 4n o i t p i r c s e d t i u c r i c " n o i t c e t o r p t u p t u o r e v i r d " r e t f a n o i t c e s " s t u p n i l a t i g i d " e v o m e l b a t d n a h p a r g a r a p w e n d d a , n o i t c e s current revision date: june 27, 2001 previous revision date: october 27, 2000 # e g a pe m a n n o i t c e sn o i s i v e r s u o i v e r p n o i s i v e r t n e r r u c 5n o i t a m r o f n i n o i t a c i l p p a : d d a n o i t c e s g n i c n e u q e s y l p p u s r e w o p : d d a 2 e r u g i f o t " d n u o r g m e t s y s l a n r e t x e "

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